induction Hot Mix Asphalt (iHMA)
Durable hot mix asphalt material for rapid repairs in the field
Innovators at ERDC’s Geotechnical & Structures Laboratory have developed a rapid method for pothole repairs called Induction Hot Mix Asphalt (iHMA) that works on demand in the field. Repairs to pavements typically involve a two-step process. First, cold mix asphalt is used on-site as a temporary fix. Next, factory-sourced hot mix asphalt (which is significantly more durable but less easy to attain) is applied as a more permanent fix. In contrast, the iHMA system offers an easy, one-step process with the convenience of cold mix asphalt and the endurance of hot mix, saving both time and cost.
Using induction heating to activate metallic particles in the mix, the iHMA system generates an even distribution of heat throughout the containerized mixture. This process brings the asphalt material to greater than 300°F in less than 5 minutes, giving it the strength and durability imperative for surfaces like runways and roadways. ERDC’s iHMA offers a superior, convenient solution for pothole repairs on any pavement.
Benefits:
- Fast: Heats 90% faster than traditional heating methods with no need for curing
- Low-cost: Less installed cost than factory-provided hot mix or cold mix
- Portable: Pre-packaged in 5-gallon buckets for convenient use in busy cities and airports
- Durable: Demonstrated higher performance (100 passes of an F15-E) in all temperatures than cold-mix asphalt
- Long life: Has an effectively unlimited shelf life (i.e., no need to rotate stock)
Applications:
- Roadways (e.g., highways, bridges)
- Airports (e.g., airfields, pavements, runways, taxiways)
- Military (e.g., bases, airfields, remote locations)
- Municipalities (e.g., population-dense urban areas)
- Racetracks (e.g., NASCAR, Formula One)
- Ports (e.g., shipping, intermodal port operations)
Patents
Resources
- Video demonstration
- ERDC article
- Technology report
- ERDC flyer
- Roads & Bridges article
- Licensing news
- Inventor interview
- USACE Innovation Summit Inventor Session